MTFC16GAPALBH-AAT is a Micron 16GB automotive e.MMC managed-NAND device, not an EEPROM or raw NAND part. The cited Micron family documentation identifies this exact MPN as a 153-ball TFBGA package measuring 11.5 mm × 13 mm × 1.1 mm, with the AAT option listed from –40°C to +105°C. It must be reviewed with the host e.MMC controller, boot design, rails, PCB layout, manufacturing process and lifecycle controls as one system.
For a BOM decision, first verify the complete MPN, package, controlled datasheet revision and lifecycle status. DigiKey currently lists the exact item as obsolete; current availability, price, lead time, traceability and alternate suitability require quote-time and manufacturer verification.
MTFC16GAPALBH-AAT at a glance
| Attribute | Verified reference information | What it means |
|---|---|---|
| Manufacturer | Micron Technology | Use the complete manufacturer MPN in the BOM and RFQ. |
| Device type | Automotive e.MMC, managed NAND plus MMC controller | Do not treat it as raw NAND or EEPROM. |
| Density | 16GB / 128Gbit | Confirm usable capacity and partitioning in the host. |
| Interface | JEDEC MMC 5.1 family documentation | Host controller and firmware must support the required initialization and modes. |
| Package | 153-ball TFBGA, 11.5 mm × 13 mm × 1.1 mm | Validate BGA footprint, routing and assembly process. |
| Temperature option | AAT: –40°C to +105°C in cited family documentation | Confirm exact project qualification requirements. |
| Lifecycle signal | DigiKey currently lists the MPN as obsolete | Use a controlled sourcing workflow, not a new-design default. |
What this part is—and what it is not
Micron’s automotive e.MMC documentation describes a MultiMediaCard controller combined with NAND flash. It lists functions such as error correction and block management, boot operation, RPMB, multiple partitions, reliable write, background operations, health reporting and field firmware update at the family level.
Family capability does not guarantee application readiness. The target SoC, operating system or boot firmware must support the needed e.MMC behavior, and the controlled datasheet and software plan must define the final implementation.
Interface, voltage and performance checks
The cited Micron family documentation states JEDEC MMC 5.1 compliance, a 12-signal interface, host-selectable x1/x4/x8 I/O widths, interface clocks up to 200 MHz, HS200/HS400 modes, VCC from 2.7V to 3.6V and dual VCCQ options of 1.70V to 1.95V or 2.7V to 3.6V.
These are integration inputs—not blanket system-performance promises. The family performance table is measured at 25°C with x8 I/O, sequential 512KB chunks, write cache enabled, queue depth eight and HS400 mode. For the 16GB density it reports typical 60 MB/s sequential write and 320 MB/s sequential read under those conditions. Validate the real host, layout, rails, workload and temperature.
Package and PCB design review
- Confirm the approved land pattern from controlled manufacturer documentation.
- Validate breakout, stack-up, via technology and signal-return paths with the board fabricator.
- Review VCC/VCCQ decoupling, reset behavior and power-up sequencing with the host.
- Define reflow, X-ray/inspection and traceability requirements in the manufacturing release.
- Confirm the target e.MMC I/O width and mode in both PCB routing and firmware.
Automotive temperature and data-retention context
The AAT option is listed in the cited family datasheet for –40°C to +105°C. The documentation also lists automotive-grade information including AEC-Q104 and PPAP at family level, plus specified retention compliance conditions.
Do not turn a family-level statement into automatic design approval. Automotive design-in requires the exact qualification evidence, customer requirements, environmental profile, system validation and change-control records.
Why lifecycle status changes the procurement workflow
DigiKey currently labels MTFC16GAPALBH-AAT as obsolete. That does not prove that supply is unavailable, and it does not identify a valid alternate. It means the RFQ needs greater control.
| RFQ item | Why it is needed |
|---|---|
| Complete MPN and suffix | Prevents an incorrect density, package, temperature or option code. |
| Quantity and delivery date | Required for a current quote and supply assessment. |
| Date-code and traceability rule | Defines acceptable material for a controlled legacy purchase. |
| Packaging requirement | Confirms handling and assembly expectations. |
| Test and quality-document needs | Lets the supplier state what can be verified. |
| Approved-alternative rules | Keeps a parametric option separate from a validated replacement. |
Need a controlled sourcing review for MTFC16GAPALBH-AAT?
Submit the full MPN, quantity, delivery date, date-code policy, packaging need, application, host configuration and approved-alternative rules through the ApexComponent inquiry form. Current availability, price, lead time, traceability documents and alternate suitability require quote-time verification.
Frequently asked questions
What is MTFC16GAPALBH-AAT?
It is a Micron 16GB automotive e.MMC managed-NAND device. The cited family datasheet lists it in a 153-ball TFBGA, 11.5 mm × 13 mm × 1.1 mm configuration.
Is MTFC16GAPALBH-AAT an EEPROM?
No. It is an e.MMC managed-NAND storage device with an MMC controller, not an EEPROM.
What does AAT mean on this part?
The cited Micron family documentation lists AAT for the –40°C to +105°C option. Confirm controlled documentation and project qualification before approval.
Can another 16GB e.MMC replace it?
Not automatically. Review package, ball map, rails, e.MMC version, boot behavior, software, temperature and qualification. Equal density alone is not compatibility.