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GAP PAD TGP 5000S35


Feature
Bergquist Thermal Pad
Gap filler thermal interface pad
Category: Hardware, Enclosures & Thermal Management
Package / mounting: Pad
Suitable for B2B component sourcing and project BOM support
Original manufacturer data should be checked before final engineering use
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GAP PAD TGP 5000S35 is a Bergquist Thermal Pad commonly used for gap filler thermal interface pad.

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