W25Q256JVEIQ


Manufacturer No: W25Q256JVEIQ
Manufacturer: Winbond
Bilikai No: APX-IC-W25Q256JVEIQ-0766
Package: WSON-8 8×6 mm (EI package code)
Description: NOR Flash
Datasheet: W25Q256JVEIQ
Upload BOM

Datasheet: https://apexcomponent.com/wp-content/uploads/2026/06/W25Q256JVEIQ-Winbond-Datasheet.pdf

W25Q256JVEIQ Product Description

W25Q256JVEIQ is a component from Winbond in the NOR Flash category. It is classified under SPI NOR Flash and supplied with package information listed as WSON-8 8×6 mm (EI package code).

The table below follows the same product information structure as the reference item. Product information is verified from the manufacturer datasheet.

Parameter Value
Manufacturer Winbond
Mfr. Part Number W25Q256JVEIQ
Product Category NOR Flash
Detailed Category Integrated Circuits (ICs) > Memory ICs > NOR Flash > SPI NOR Flash
Package WSON-8 8×6 mm (EI package code)
Mounting Type SMD / SMT
Qualification Catalog
Application code shadowing, Large firmware storage, XIP-capable systems Brand: Winbond Suita

Key Features

Feature Description
Manufacturer Winbond
Product Type NOR Flash
Package WSON-8 8×6 mm (EI package code)
Detailed Category Integrated Circuits (ICs) > Memory ICs > NOR Flash > SPI NOR Flash
Mounting Type Surface Mount (SMD/SMT)
Qualification Standard (Commercial)
Application code shadowing, Large firmware storage, XIP-capable systems Brand: Winbond Suita
Data Verification Refer to datasheet if no reliable source data is available

Select at least 2 products
to compare