W25Q64JVSSIQ

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W25Q64JVSSIQ

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Manufacturer No: W25Q64JVSSIQ
Manufacturer: Winbond
Bilikai No: APX-IC-W25Q64JVSSIQ-0765
Package: SOIC-8 208 mil (SS package code)
Description: NOR Flash
Datasheet: W25Q64JVSSIQ
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Datasheet: https://apexcomponent.com/wp-content/uploads/2026/06/W25Q64JVSSIQ-Winbond-Datasheet.pdf

W25Q64JVSSIQ Product Description

W25Q64JVSSIQ is a component from Winbond in the NOR Flash category. It is classified under SPI NOR Flash and supplied with package information listed as SOIC-8 208 mil (SS package code).

The table below follows the same product information structure as the reference item. Product information is verified from the manufacturer datasheet.

Parameter Value
Manufacturer Winbond
Mfr. Part Number W25Q64JVSSIQ
Product Category NOR Flash
Detailed Category Integrated Circuits (ICs) > Memory ICs > NOR Flash > SPI NOR Flash
Package SOIC-8 208 mil (SS package code)
Mounting Type SMD / SMT
Qualification Catalog
Application Firmware storage, IoT modules Brand: Winbond Suitable for embed, MCU boot memory
SKU: APX-IC-W25Q64JVSSIQ-0765 Category: Tags: , , , , Brand:

Key Features

Feature Description
Manufacturer Winbond
Product Type NOR Flash
Package SOIC-8 208 mil (SS package code)
Detailed Category Integrated Circuits (ICs) > Memory ICs > NOR Flash > SPI NOR Flash
Mounting Type Surface Mount (SMD/SMT)
Qualification Standard (Commercial)
Application Firmware storage, IoT modules Brand: Winbond Suitable for embed, MCU boot memory
Data Verification Refer to datasheet if no reliable source data is available

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