Coverage: July 25–August 1, 2026Published: August 1, 2026 This Week’s Procurement Signals AI infrastructure continues to pull demand toward HBM/DRAM, advanced packaging, wafer-fab equipment, silicon photonics, and high-volume test. At
Coverage: July 18–25, 2026Published: July 25, 2026 This week’s procurement signal is concentrated in AI infrastructure: memory remains seller-led, advanced packaging is becoming a directly financed bottleneck, and foundry pricing
Coverage: July 10–17, 2026 Published: July 18, 2026 This week’s signals point to the same broad theme: AI-related demand continues to pull investment toward advanced logic, packaging, and high-speed interconnect,
In early 2026, Micron confirmed that its entire HBM production capacity for the year was sold out. Not “tight.” Not “under allocation.” Sold out — with orders locked in more
I’ve been tracking semiconductor pricing for years, and I’ve never seen a setup quite like June 2026. The market is projected to hit $1.51 trillion this year. That’s an 89.9%
If you’re sourcing components for an AI server build right now, you already know the GPU situation is a headache. That story has been told a hundred times. But here’s
1. First, the Big Picture: What the Hell Is Happening in MLCC? H1 2026 in the MLCC market. Two words: structural mania. Not broad inflation. Not the kind of across-the-board
Summary — AI server racks are pushing past 200 kW toward the megawatt scale, and the power delivery architecture that feeds GPU and CPU core rails is under more pressure
Abstract AI is not only increasing demand for compute chips. It is also changing the power architecture behind AI servers and data centers. As rack-level power continues to rise, power
